NSEDividend5d ago · 26 Aug 2026, 03:12 pm
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Mold-Tek Technologies Limited · MOLDTECH
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Mold-Tek Technologies Limited has informed the Exchange that its Board of Directors has recommended a final dividend of Rs. 2 per equity share for the financial year March 31, 2026. The company also announced a 1:1 bonus issue of equity shares.
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Full Announcement
Mold-Tek Technologies Limited has informed the Exchange that Board of Directors at its meeting held on August 26, 2026, recommended Final Dividend of Rs. 2 per equity share.
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MTTL/SECT/27/2025-26 Date: August 26, 2026
The Secretary, The Manager, Listing Department,
Listing Department, National Stock Exchange of India Limited,
BSE Ltd., Exchange Plaza, 5th Floor, Plot No. C/1,
Phiroze Jeejeebhoy Towers, G Block, Bandra Kurla Complex,
Dalal Street, Fort, Mumbai-400001. Bandra (E), Mumbai-400051.
Scrip Code: 526263 Symbol: MOLDTECH - EQ
Sir/Madam,
Sub: Outcome of the Board Meeting held on August 26, 2026.
This is to inform you that the Board of Directors (Board) of the Company at its meeting held today i.e.
Wednesday, August 26, 2026, inter-alia, transacted the following business (es):
1. Issuance of Bonus Shares:
Issuance of Bonus equity shares in the ratio 1:1 i.e. 1 (One) equity shares of Rs. 2/- each for every
1 (One) full paid-up equity share of Rs. 2/- each held by the Shareholders of the Company as on
the Record Date, subject to the approval of Shareholders. The Company will inform the “Record
Date” for determining the entitlement of the Shareholders to receive Bonus Shares in due course.
2. Recommending Final Dividend:
Recommending a final dividend of ₹ 2.00/- per equity share for the financial year March 31, 2026
on Equity Shares of face value of ₹ 2/- each.
This Dividend of ₹ 2.00/- per equity share is subject to the approval of Members at the ensuing
Annual General Meeting which will be held on September 21, 2026. The dividend if declared will
be paid (subject to deduction/withholding of applicable taxes) within the timelines prescribed under
the law.
The Record date for determining the entitlement of the Shareholders to the final divided is
September 14, 2026.
3. Fixing of Annual General Meeting:
Approved the convening of 42nd Annual General Meeting of the Company on Monday, September
21, 2026 through video conference/ Other Audio Visual Means.
4. Book Closure:
The Register of Members and the Share Transfer Books of the Company will be closed for the
purpose of the 42nd Annual General Meeting (AGM) and determining the entitlement of the
Members for the final dividend of the Company from Tuesday, September 15, 2026 to Monday,
September 21, 2026 (both days inclusive).
Mold-Tek Technologies Limited
Regd. Off.: Plot No.700, Door No.8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India
Phone: +91-40-40300300/01/02/03/04, Fax: +91-40-40300328, E-mail Id: cstech@moldtekindia.com
Website: www.moldtekindia.com CIN No: L25200TG1985PLC005631
Further, the details as required under Regulation 30 of the Securities and Exchange Board of India
(Listing Obligations and Disclosure Requirements) Regulations, 2015 of the SEBI Circular
SEBI/HO/CFD/PoD2/CIR/P/0155 dated 11th November 2024 and SEBI Master Circular dated
January 30, 2026 as ‘Annexure I’ are enclosed as Annexure-A.
The meeting of Board of directors commenced at 01:30 PM (IST) and concluded at 02:55 PM (IST).
This is for your kind information and record.
Thanking you,
For Mold-Tek Technologies Limited
Prateek Kumar Tiwari
Company Secretary & Compliance Officer
Encl: A/a
Mold-Tek Technologies Limited
Regd. Off.: Plot No.700, Door No.8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India
Phone: +91-40-40300300/01/02/03/04, Fax: +91-40-40300328, E-mail Id: cstech@moldtekindia.com
Website: www.moldtekindia.com CIN No: L25200TG1985PLC005631
Annexure - A
Disclosure of Information pursuant to Regulation 30 of the SEBI Listing Regulations read with
SEBI circular No. SEBI/HO/CFD/PoD2/CIR/P/0155 November 11, 2024 and SEBI Master
Circular dated January 30, 2026.
Sr. Particulars Details
1. Type of securities proposed to be Equity Shares
issued (viz. equity shares,
convertibles etc.);
2. Type of issuance Bonus Issue
3. Total number of securities proposed 2,88,05,118 Equity Shares of Rs. 2/- each amounting to
to be issued or total amount for Rs. 5,76,10,236/- (Rupees Five Crores Seventy Six Lacs
which the securities will be issued Ten Thousand Two Hundred Thirty Six Only).
(approximately)
4. Whether bonus out of free reserves, The Bonus equity Shares will be issued out of Free
I created out of profits or share Reserve of the Company available as on March 31,
premium account 2026.
5. Bonus Ratio 1:1 i.e. 1 (One) Bonus Equity Share of Rs. 2/- each for
every 1 (One) fully paid-up equity shares of Rs. 2/- each
held as on the record date.
6. Whether bonus is out of free Yes. Bonus Equity Shares will be issued from free
reserves created out of profits or reserve, Retained Earnings and Securities Premium and
share premium account; other eligible reserves available with Company.
7. Details of share capital - pre and Pre-Bonus issue Paid up Share Capital: Rs.
post bonus issue 5,76,10,236/- divided into 2,88,05,118 Equity Shares of
face value of Rs. 2/- each and Post Bonus Issue: Rs.
11,52,20,472/- divided into 5,76,10,236 Equity Shares of
face value of Rs. 2/- each.
8. Free Reserves and/or Share Rs. 5,76,10,236/- (Rupees Five Crores Seventy-Six Lacs
Premium required for implementing Ten Thousand Two Hundred Thirty-Six Only) will be
the bonus issue; utilized from Free Reserve/Retained Earning of
Company
9. Free Reserves and/or Share Rs. 1,15,00,36,940 available in Free Reserve/Retained
Premium available for capitalization Earning of Company as on 31st March, 2026
and the date as on which such
balance is available;
10. whether the aforesaid figures are No
audited
11. estimated date by which such bonus The Bonus issue will be implemented within 2 months
shares would be credited/dispatched from the date of Board Meeting.
Mold-Tek Technologies Limited
Regd. Off.: Plot No.700, Door No.8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India
Phone: +91-40-40300300/01/02/03/04, Fax: +91-40-40300328, E-mail Id: cstech@moldtekindia.com
Website: www.moldtekindia.com CIN No: L25200TG1985PLC005631
Mold-Tek Technologies Limited
Regd. Off.: Plot No.700, Door No.8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India
Phone: +91-40-40300300/01/02/03/04, Fax: +91-40-40300328, E-mail Id: cstech@moldtekindia.com
Website: www.moldtekindia.com CIN No: L25200TG1985PLC005631