NSEInvestor Presentation6d ago · 25 Aug 2026, 02:14 pm

Investor Presentation

Cyient Limited · CYIENT

✦ AI SummaryProduct Launch

Cyient Limited has held an investor presentation, highlighting its growth engines, business evolution, and semiconductor strategy.

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Earnings Impact2/10
Growth Catalyst8/10
Governance Concern1/10
Regulatory Risk1/10
Balance Sheet Risk1/10
Liquidity Impact5/10
Market Sentiment6/10

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Cyient Limited has informed the Exchange about Investor Presentation

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CYIENT_25082026141352_InvestorDayMdCeoCboCSemiSigned.pdf

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25 August 2026 BSE Limited National Stock Exchange of India Ltd PJ Towers, 25th Floor, Exchange Plaza, Dalal Street Bandra-Kurla Complex, Bandra (E) Mumbai 400001. Mumbai-400 051. Scrip Code: 532175 Scrip Code: CYIENT Dear Sir /Madam, Sub: Investor Day - Updates Further to our letter dated 23 July 2026, the Senior Management of the Company presented insights into the Company's business and allied matters during the Investor Day today. The related presentations are enclosed. This is for your information and records. Thanking you For Cyient Limited Ravi Kumar Nukala Dy. Company Secretary Cyient Ltd. 4th Floor, A Wing, 11 Software CIN: L72200TG1991PLC013134 Units Layout, Madhapur www.cyient.com Hyderabad -500 081 Company.secretary@cyient.com India T +91 40 6764 1000 F +91 40 2311 0352 Three Growth Engines Built to Compound Value Krishna Bodanapu Executive Vice Chairman & Managing Director The Arc of This Session Built for What’s Next EVOLVING HOW WE HAVE THE STRUCTURE WHERE WE WIN LANDSCAPE RESPONDED WE HAVE BUILT NEXT Outsourcing has shifted Three decades of deliberate Three focused companies, Technology & IP-led pivots from labour arbitrage to reinvention: data → one value chain. Each across DET, DLM and outcome and IP ownership engineering → digital → independently governed; Semiconductors, and - across ER&D, EMS and manufacturing → together worth more than emerging shared themes semiconductors semiconductors the sum across the group Over the last decade, the industry has transformed from cost-led outsourcing to value-based partnerships Stay at capacity and you compete for a sliver of spend; own the lifecycle and the pie is several times larger — and far higher-margin 30x SPEND · 4x MARGINS → INCREASING VALUE · MARGIN · OWNERSHIP → VALUE OUTPUT Lifecycle ownership and outcomes Delivery accountability CAPABILITY and risk-sharing CAPACITY Domain depth Labor arbitrage 75-80% 90% 2-7 years to design of an Aero OEM’s revenue comes from of a Telecom operator’s spend is in 20-100 years to create value aftermarket, not new engines operations and lifecycle management Engineering Evolution Car Fuel Indicator MECHANICAL ELECTRICAL ELECTRONIC DIGITAL INTELLIGENT Our Evolution We have reinvented ahead of every shift, for three decades Each move added a layer of capability — and each layer now compounds with the others. 1991 2014 2018 2023 Founded as Rebranded Cyient – Strengthened Cyient DLM IPO — Infotech Enterprises symbolizing focus on portfolio with IP-led giving it the capital — specializing in science & client custom ASIC structure for growth geospatial data centricity solutions services 2001 2015 2020 2025 Pratt & Whitney Becoming Strengthened Cyient Semiconductors partnership industry’s only digital portfolio carve out - giving it the establishes design-led and added ‘energy focus to scale as an engineering manufacturing transition’ IP-led business leadership provider Mechanical → Electrical → Electronic → Digital → Intelligent · Capacity Fulfilment → Value Creation $821M 17K+ 30+ Engineers Countries of Operation FY26 Group Revenue Where We Go From Here Five structural forces are redefining how value will be created The opportunity is to engineer the intersection, not chase each trend independently Democratization Domain & Regionalization Sustainability New of Talent Technology & Resilience Becoming Value Creation Convergence Non-Negotiable Models Intelligence moves Engineering & supply Energy, material and Talent is becoming Value shifts from into engineering, chain reorganize lifecycle efficiency more globally capacity and effort products and around localization become core distributed, with new toward outcomes, operations, creating and technology requirements, not just ecosystems emerging IP and lifecycle new value pools sovereignty statutory obligations beyond traditional hubs ownership Purpose-Built for What’s Next Three growth engines. One Portfolio. Structured to unlock disproportionate value Independently governed and separately accountable; deliberately adjacent so each opens doors for the others POWER AT THE CORE ENGINEERED BUILT ONE PRODUCT. ONE PARTNER Designed to Perform to the Last Detail for Mission Success Ownership across the Lifecycle E N G IN E E R DE S IG N RE ALIZE S USTAIN Digital | Engineering | Technology CYIENT Digital | Engineering | Technology Intelligent Engineering for Every Lifecycle Products Plants Networks Chip to Cloud · Design to Aftermarket Concept to Commissioning · Commissioning to Cash Flow Plan to Deployment · Rollout to Operate Breadth of lifecycle. Depth of domain. Driving the Next Phase of Value Creation Market Impact Technology Adoption Organizational Effectiveness Domain-first positioning and Converting domain and technology Creating differentiated value through winning the shift to outcomes convergence to revenue talent, leadership, and governance SEMICONDUCTORS From Design to Differentiation The Semiconductor Market Where the growth and the value is concentrating A structural growth wave, and a strong potential for India Power is the fastest growing frontier India’s semiconductor market is booming • AI data centers, EVs and electrification demand higher • $10B+ India Semiconductor Mission plus PLI / DLI voltage, density and efficiency building a product-led ecosystem • Catalogue SKUs cannot keep pace — custom, • ~20% of the world’s chip designers are Indians (3rd IP-owned power ASSPs capture the value largest design hub globally) • The fastest-growing, highest-margin part of analog • No standalone Indian product leader yet — that gap is the opportunity $80B $200B Power IC Market (by 2035) India Semi Market (by 2035) Our Semiconductor Strategy Fabless Product Company We Own the Silicon. We Deliver the Finished Product. Application-Specific Standard Products Application-Specific Integrated Circuits Owned products at scale Customer-specific silicon DATA CENTERS INDUSTRIAL EDGE AI AUTOMOTIVE MEDICAL INDUSTRIAL O W N E D I P • M U LT I - C U STO M E R • S C A L A B L E E C O N O M I C S F U N D S T H E ROA D M A P • B U I L D S T R U ST • E X PA N D S R E U S A B L E I P Riding the India Wave: Strategic Government Programs | ISM 2.0 Design Collaboration | Exclusive GaN Partnership Momentum Today 100+ PATENTS · 250+ PRODUCTS · 3B+ CHIPS DELIVERED Launched India's First Intelligent Power Silicon ASIC for GPS ASIC for Laser Distance ASIC for Smart ASSPs for Power Conversion and Protection Receiver Measurement Metering MANUFACTURING From Build to Value The EMS Market Electronics manufacturing is moving up the complexity curve The value shifts from build-to-print towards NPI, lifecycle support and product realization Electronification + Electrification Defense Spend, Now Electronics-led Digitization and AI infrastructure driving sustained electronics Modern platforms are defined by electronics — sensors, content growth with increased focus on power efficiency comms, EW and C4ISR — amid rising global budgets. Lifecycle Ownership Regional Resilience Customers consolidate towards partners who can take Supply chain localization and sovereignty-driven complete design-to-build ownership, not only assemble onshoring in regulated industries $1.8T $320B 25% CAGR – India EMS market Global EMS Market (2035) Defense electronics (2035) EMS spend on design & engineering CAGR – US EMS market Our DLM Strategy From outsourcing partner to design-led play High-mix and high-reliability manufacturing, where engineering capability matters more than sheer scale Build to Print Design-Led, IP-Anchored Where we are focusing • High growth adjacencies • Customer owns the design and the IP • Design services, B2S and NRE revenue ahead of build (semi-cap, data centers, robotics) • Revenue tied to volume and conversion • Own product platforms and designs • Power electronics • Margins bounded by contract manufacturing economics • Deeper lifecycle ownership with the customer • Valued as capacity • Valued as capability and IP • India adv [Showing first 8,000 characters — download PDF for full document]