Mold-Tek Packaging Ltdhas informed BSE that the meeting of the Board of Directors of the Company is scheduled on 26/08/2026 ,inter alia, to consider and approve Issuance of Bonus Shares, ....

MTPL/SECT/29/2026-27 Date: August 21, 2026 To To The Secretary, The Manager, Listing Department, Listing Department, BSE Limited, National Stock Exchange of India Limited, Phiroze Jeejeebhoy Towers, Exchange Plaza, 5th Floor, Plot No. C/1, Dalal Street, G Block, Bandra Kurla Complex, Fort, Mumbai-400001. Bandra (E), Mumbai-400051. Scrip Code: 533080 Symbol: MOLDTKPAC Sir/Madam, Sub: Intimation of Board Meeting Pursuant to Regulation 29 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015 (“SEBI Listing Regulations”), as amended, we hereby inform you that, a meeting of the Board of Directors of the Company is scheduled to be held on Wednesday, August 26, 2026, inter-alia, to: 1. consider the proposal for issuance of fully paid Bonus Equity Shares to the existing equity shareholders of the Company. 2. discuss and consider increase in Authorized Share Capital of the Company, subject to approval of shareholders. 3. recommend final dividend, if any, on the equity shares of the Company for the Financial Year ended on March 31, 2026. 4. fix day, date, time and venue for convening the 29th Annual General Meeting of the Company and approval of the draft Notice thereof. 5. fix the Cut-off/Record date for the purpose of sending notice and payment of Final dividend for the Financial Year 2025-26, if declared, at the 29th AGM and e-voting for the said AGM. This is for your information and records. Thanking you, For Mold-Tek Packaging Limited Lakshmana Rao Janumahanti Chairman and Managing Director DIN: 00649702 Registered and Corporate Office: 8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India Phone: +91-40-40300300, E-mail Id: cs@moldtekpackaging.com / ir@moldtekpackaging.com, Website: www.moldtekpackaging.com, CIN No.: L21022TG1997PLC026542