BSECompany Update2d ago · 18 Aug 2026, 01:09 pm

Press Release titled - Mamata Machinery files patent application in India for its Die and Screw design, the core enabling technology behind RecTech, its recyclable Film Technology

Mamata Machinery Ltd · 544318

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Mamata Machinery Ltd has filed a patent application in India for its Die and Screw design, the core enabling technology behind RecTech, its Recyclable Film Technology.

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Earnings Impact2/10
Growth Catalyst8/10
Governance Concern1/10
Regulatory Risk1/10
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Liquidity Impact8/10
Market Sentiment8/10

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Mamata Machinery Ltd - 544318 - Announcement under Regulation 30 (LODR)-Press Release / Media Release

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Date: August 18, 2026 To To BSE Limited The National Stock Exchange of India Limited P J Towers, “Exchange Plaza”, Dalal Street, Bandra – Kurla Complex, Mumbai – 400 001 Bandra (E), Mumbai – 400 051 Scrip Code: 544318 Scrip Code: MAMATA Sub.: Disclosure under Regulation 30 of the SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015 (‘SEBI LODR’) – Press Release Dear Sir, Pursuant to the applicable provisions of Regulation 30 and other applicable provisions of the SEBI LODR, please find attached herewith a copy of press release issued by the Company titled: “Mamata Machinery files a patent application in India for its Die and Screw design, the core enabling technology behind RecTech, its Recyclable Film Technology” This is for your information and records. Thanking you. Yours faithfully. For, Mamata Machinery Limited Madhuri Sharma Company Secretary & Compliance Officer Encl.: A/a. MAMATA MACHINERY LIMITED (Formerly Known as Mamata Machinery Private Limited) (CIN: L29259GJ1979PLC003363) Regd. Office: Survey No.423/P, Sarkhej-Bavla Road, Moraiya, Tal: Sanand, Dist: Ahmedabad-382213, Gujarat, India Phone: +91-2717-630800 | E-mail: info@mamata.com | Website: www.mamata.com PRESS & MEDIA RELEASE Mamata Machinery files a patent application in India for its Die and Screw design, the core enabling technology behind RecTech, its Recyclable Film Technology Ahmedabad, India – August 18, 2026: Mamata Machinery Limited (‘Mamata’ or ‘the Company’), a leading machinery solution provider in the flexible packaging industry, today announced that it has filed a patent application with the Indian Patent Office (Intellectual Property India) for its Die and Screw design. This design is the fundamental enabling technology behind RecTech, the Company’s Recyclable Film Technology. This filing reflects Mamata’s focus on building breakthrough technologies such as RecTech while securing the intellectual property that underpins them, reinforcing its position as a technology-driven player in flexible packaging machinery. About the Company: Mamata Machinery Limited is a leading global provider of total flexible packaging machinery solutions, offering a comprehensive range of products across the value-chain, from co-extrusion to converting and advanced packaging machinery. With over 35 years of industry experience, Mamata has established itself as a trusted engineering enterprise, boasting more than 5,400 machine installations in 80 countries worldwide. The Company is renowned for its consistent innovation and numerous industry-first product introductions, delivering cutting-edge solutions that address the evolving needs of the flexible packaging sector. Mamata’s commitment to technology, quality, and customer-centric design has made it a preferred partner for businesses seeking reliable and efficient flexible packaging solutions on a global scale. For more details, get in touch: Madhuri Sharma Sayam Pokharna CS & Compliance Officer Investor Relations Advisor MAMATA MACHINERY LIMITED TIL ADVISORS PRIVATE LIMITED investor@mamata.com sayam@theinvestmentlab.in 01 MAMATA MACHINERY LIMITED