Audio Recording of Conference Call for Investors held on July 27, 2026

MTPL/SECT/24/2026-27 Date: July 27, 2026 To To The Secretary, The Manager, Listing Department, Listing Department, BSE Limited, National Stock Exchange of India Limited, Phiroze Jeejeebhoy Towers, Exchange Plaza, 5th Floor, Plot No. C/1, Dalal Street, G Block, Bandra Kurla Complex, Fort, Mumbai-400001. Bandra (E), Mumbai-400051. Scrip Code: 533080 Symbol: MOLDTKPAC Dear Sir/Madam, Sub: Audio Recording of Conference Call for Investors held on July 27, 2026. Pursuant to the Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements), Regulations 2015 and further to our letter dated July 22, 2026, please note that the audio recording of the Conference Call for investors held on July 27, 2026, at 4:30 PM (IST), to discuss Q1FY27 results of the Company has been uploaded on our website on the following web-link: https://moldtekpackaging.com/pdf/Audio%20Recording%20of%20Q1FY27%20Earnings%20Call.mp3 This is for your kind information and records. Thanking you, Yours faithfully, For Mold-Tek Packaging Limited J. Lakshmana Rao Chairman and Managing Director DIN: 00649702 Registered and Corporate Office: 8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India Phone: +91-40-40300300, E-mail Id: cs@moldtekpackaging.com / ir@moldtekpackaging.com, Website: www.moldtekpackaging.com, CIN No.: L21022TG1997PLC026542