Press Release

Date: 26th June 2026 To To Secretary Secretary Listing Department Listing Department BSE Limited National Stock Exchange of India Ltd. Department of Corporate Services Exchange Plaza, C-1, Block G, Bandra Kurla Phiroze Jeejeebhoy Towers Dalal Street, Complex, Bandra (E) Mumbai– 400 051 Mumbai – 400 001 Scrip Code: 540902 Symbol: AMBER ISIN: INE371P01015 ISIN: INE371P01015 Dear Sir/Ma’am, Sub: Press Release titled “Schweizer Electronic and Ascent Circuits Plan Strategic Indo-German PCB Cooperation” Ref: Disclosure under Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015, as amended (“SEBI (LODR) Regulations”) Pursuant to the Regulation 30 of SEBI (LODR) Regulations, 2015 as amended, please find enclosed herewith a Press Release titled “Schweizer Electronic and Ascent Circuits Plan Strategic Indo-German PCB Cooperation” which is self-explanatory. This information is also being hosted on the Company’s website, at https://www.ir.ambergroupindia.com/news-events/#press-release. Kindly take the same into your records and oblige. Thanking You, Yours faithfully For Amber Enterprises India Limited (Konica Yaadav) Company Secretary and Compliance Officer Membership No. : A30322 PRESS RELEASE Schweizer Electronic and Ascent Circuits Plan Strategic Indo-German PCB Cooperation Gurugram, India; June 26, 2026: Schweizer Electronic AG and IL JIN Electronics (India) Pvt. Limited, part of the Amber Group, intend to enter into a strategic cooperation in the field of printed circuit boards. IL JIN Electronics operates its bare PCB business through its subsidiaries, with the cooperation specifically focussed on Ascent Circuits. The planned cooperation will combine Schweizer’s long-standing experience in automotive and industrial PCB applications with Ascent Circuits’ manufacturing footprint and expansion plans in India. It will create additional value for customers in European and US region by strengthening supply-chain resilience, broadening sourcing options and preparing a structured path toward future technology capabilities. In the first phase, the partners will focus on selected standard automotive and industrial PCB applications based on existing manufacturing capabilities. In parallel, the cooperation will prepare a step-by-step roadmap toward more complex multilayer and HDI applications as future Indian capacities become available. A key element of the cooperation will be the alignment of customer requirements, technical capabilities, capacity needs and commercial competitiveness. High quality, qualification and process standards will also play an important role in order to meet the expectations of demanding automotive and industrial customers. The partners also intend to evaluate selected future growth areas in other industries where the cooperation can create long-term customer value. The cooperation reflects the increasing importance of diversified, reliable and geopolitically resilient supply chains in the global electronics industry. For customers, it will o(cid:431)er additional options in a changing market environment. For both companies, it represents an opportunity to combine complementary strengths and build a scalable platform for future growth. *************