BSECorp. Action28 Sept 2026 · 28 Sept 2026, 11:58 am

Intimation of Record date for Bonus issue of Equity Shares

Mold-Tek Technologies Ltd · 526263

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Mold-Tek Technologies Ltd has announced a bonus issue of equity shares, with a record date of October 09, 2026, and a bonus ratio of 1:1. The bonus shares will be credited to the members whose names appear on the register of members as on the record date.

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Earnings Impact0/10
Growth Catalyst0/10
Governance Concern0/10
Regulatory Risk0/10
Balance Sheet Risk0/10
Liquidity Impact8/10
Market Sentiment6/10

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Mold-Tek Technologies Ltd - 526263 - Fixing Of Record Date For Bonus Issue Of Equity Shares

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MTTL/SECT/39/2026-27 Date: September 28, 2026 To, To, The Secretary, The Manager, Listing Department, Listing Department, BSE Ltd., National Stock Exchange of India Limited, Phiroze Jeejeebhoy Towers, Exchange Plaza, 5th Floor, Plot No. C/1, Dalal Street, G Block, Bandra Kurla Complex, Fort, Mumbai-400001. Bandra (E), Mumbai-400051. Scrip Code: 526263 Symbol: MOLDTECH Dear Sir/Madam, Sub: Intimation of Record Date for the purpose of allotment of Bonus Equity Shares as per Regulation 42 of the SEBI (Listing obligations and Disclosure Requirements), Regulations, 2015 Please note that the Members of the Company have approved the issue of Bonus Shares in the proportion of 1 (One) Bonus Equity Share of Rs. 2/- (Rupees Two Only) each, for every 1 (One) fully paid-up Equity Share of Rs. 2/- (Rupees Two Only) each, existing Equity Share held by the Members and that the Bonus Shares so distributed shall, for all purpose, be treated as an increase in the paid-up capital of the Company. We further wish to inform that the Board of Directors of the Company, in their meeting held on 28th September, 2026 have approved and fixed October 09, 2026 as the Record Date for the purpose deciding the Members who shall be eligible to the allotment of the Bonus Shares as per ratio mentioned above by capitalization of such amount as may be required, from the Securities Premium Account, Free Reserves or any other permitted reserves/ surplus of the Company for the purpose of issue of Bonus Shares of Rs. 2/- (Rupees Two Only) each, credited as fully paid-up to the holders of the Equity Shares of the Company, whose names appear on the Register of Members on the Record Date of October 09, 2026. The fully paid-up Bonus Shares shall be distributed to the Members of the Company, whose names appear on the Register of Members as on October 09, 2026, of the Company. The Bonus Shares so allotted shall rank pari-passu in all respects with the fully paid-up Equity Shares of the Company as existing on October 09, 2026. Disclosure under Regulation 42 of SEBI (Listing obligations and Disclosure Requirements), Regulations, 2015 Details ISIN INE835B01035 Series EQ Book Closure (B) / Record Date (R) October 09, 2026 BC Start Date N/A BC End Date N/A Purpose Issue of Securities-Bonus Equity Shares Corporate Action Type Bonus Issue of Securities – Bonus Ratio of Bonus 1:1 Shareholder Meeting Date September 21, 2026 Deemed date of allotment October 12, 2026 Kindly acknowledge receipt of the same. Thanking you Yours faithfully, For Mold-Tek Packaging Limited Lakshmana Rao Janumahanti Chairman and Managing Director DIN: 00649702 Mold-Tek Technologies Limited Regd. Off.: Plot No.700, Door No.8-2-293/82/A/700, Road No.36, Jubilee Hills, Hyderabad – 500033, Telangana, India Phone: +91-40-40300300/01/02/03/04, Fax: +91-40-40300328, E-mail Id: cstech@moldtekindia.com Website: www.moldtekindia.com CIN No: L25200TG1985PLC005631