BSECompany Update10h ago · 22 Jul 2026, 09:11 am
Intimation under Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements), Regulations, 2015 - Signing of Memoradum of Understanding (MoU) with MP State Electronics Development ....
Paras Defence and Space Technologies Ltd · 543367
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Paras Defence and Space Technologies Ltd has signed a Memorandum of Understanding (MoU) with MP State Electronics Development Corporation (MPSeDC) to establish a greenfield advanced IC packaging OSAT facility in Madhya Pradesh with a proposed investment of approx. Rs. 6,200 Crores.
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Paras Defence and Space Technologies Ltd - 543367 - Announcement under Regulation 30 (LODR)-Memorandum of Understanding /Agreements
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July 22, 2026
BSE Limited National Stock Exchange of India Limited
Phiroze Jeejeebhoy Towers, Exchange Plaza, Plot C/1, G Block,
Dalal Street, Bandra – Kurla Complex,
Fort, Mumbai – 400 001 Bandra – (East), Mumbai – 400051
Scrip Code: 543367 Trading Symbol: PARAS
Dear Sir/ Madam,
Subject : Intimation under Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements)
Regulations, 2015 – Signing of Memorandum of Understanding (MoU) with MP State
Electronics Development Corporation (MPSeDC).
We are pleased to inform that Paras Semiconductors Private Limited (“Paras Semiconductors”), a subsidiary of Paras
Defence and Space Technologies Limited has signed a Memorandum of Understanding (MoU) with Department of
Science and Technology acting through MP State Electronics Development Corporation (MPSeDC).
Paras Semiconductors and MPSeDC will integrate their respective expertise and resources to collaboratively facilitate
the establishment of a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility
in Madhya Pradesh.
Paras Semiconductors will set up a greenfield advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh,
with a proposed investment of approx. Rs. 6,200 Crores. The facility will undertake advanced packaging operations
including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out
packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability.
Kindly take the above information on record and acknowledge the receipt.
You are requested to disseminate the above information on your respective websites.
Thanking you,
For Paras Defence and Space Technologies Limited
Minal B Bhate
Company Secretary and Compliance Officer
M. No.: 20188