General Updates

July 22, 2026 BSE Limited National Stock Exchange of India Limited Phiroze Jeejeebhoy Towers, Exchange Plaza, Plot C/1, G Block, Dalal Street, Bandra – Kurla Complex, Fort, Mumbai – 400 001 Bandra – (East), Mumbai – 400051 Scrip Code: 543367 Trading Symbol: PARAS Dear Sir/ Madam, Subject : Intimation under Regulation 30 of SEBI (Listing Obligations and Disclosure Requirements) Regulations, 2015 – Signing of Memorandum of Understanding (MoU) with MP State Electronics Development Corporation (MPSeDC). We are pleased to inform that Paras Semiconductors Private Limited (“Paras Semiconductors”), a subsidiary of Paras Defence and Space Technologies Limited has signed a Memorandum of Understanding (MoU) with Department of Science and Technology acting through MP State Electronics Development Corporation (MPSeDC). Paras Semiconductors and MPSeDC will integrate their respective expertise and resources to collaboratively facilitate the establishment of a greenfield advanced IC packaging OSAT (Outsourced Semiconductor Assembly and Test) facility in Madhya Pradesh. Paras Semiconductors will set up a greenfield advanced IC packaging OSAT facility in Indore-Ujjain, Madhya Pradesh, with a proposed investment of approx. Rs. 6,200 Crores. The facility will undertake advanced packaging operations including 3D heterogeneous integration, 2.5D/3D advanced packaging, hybrid bonding, ultra-high-density fan-out packaging, chiplet integration, wafer bumping, flip-chip assembly, testing and reliability. Kindly take the above information on record and acknowledge the receipt. You are requested to disseminate the above information on your respective websites. Thanking you, For Paras Defence and Space Technologies Limited Minal B Bhate Company Secretary and Compliance Officer M. No.: 20188