Outcome of Board Meeting

13th July, 2026 To, To, National Stock Exchange of India Ltd BSE Limited Exchange Plaza, 5th Floor, 1st Floor, New Trading Ring, Plot No. C/1, G block, Rotunda Building, Bandra-Kurla Complex, Phiroze Jeejeebhoy Towers, Bandra (E), Mumbai 400051. Dalal Street, Mumbai 400001. Scrip ID - HPAL Scrip Code – 543433 Sub : Outcome of the board meeting under Regulation 30 of the Securities and Exchange Board of India (Listing Obligation and Disclosure Requirements) Regulations, 2015 (“Listing Regulations”). Dear Sir/Madam, This is to inform that the Board of Directors of the Company at their meeting held today, i.e., on July 13, 2026, inter alia, considered and approved availing of Working Capital Term Loan (ECLGS) of Rs. 21.6 million at 9% p.a. for a total tenure of 5 years with 1 year moratorium of principal payments from ICICI Bank Limited. The meeting commenced at 04:00 p.m. and concluded at 04:30 p.m. This information is also being uploaded on the website of the Company i.e. www.hpadhesives.com under the Investor relations section. You are requested to take the above information on record. Thanking you. For HP Adhesives Limited Swati Talgaonkar Company Secretary ACS30463 Encl.: As above